Our Strengths
High Speed digital, Mixed Signals
Analog and Power Boards
High Pin Count & Fine Pitch Micro BGA Designs
Multi Layer Boards
DFF Analysis - Design for Fabrication
DFM and DFT Compliant
Signal and Power Integrity Analysis
EMI/ EMC Analysis
Impedance Matching and Controlled Impedance
Blind / Buried and Micro vias
High Density Interconnect
Layer Stack Selections
Decoupling
Complies with IPC 2221,2222
Constraint Driven High - Speed Designs
Tool Migration:
Tool to Tool Conversion
PCB-Gerber Translation
Library-Schematic Translation
Component / PCB Reverse Engineer:
BOM Analysis
3D Step Model Development (Freecad)
Obsolescence Management
Tools Expertise:
Orcad
Cadence
Altium
Mentor Graphics
xDx-Designer
PADs Expedition
Easy PC
We work on:
Freescale, TI, ARM, Atmel, Xilinx, Altera, Microchip
DDR2/3/4, QDR, USB, Ethernet, PCIe, SDIO, etc., MMC, SD
High Speed IO Interconnects
SATA, HDMI, IDE,
Wifi, BT, Zigbee, NFC, GPS, GSMg
ARM, AVR, PIC, At89xx
Relay based systems
Serial communication
High Power/Low Power SMPS
